Labelexpo Americas 2024, the Americas’ largest label and package printing technology trade show, will host new areas highlighting industry topics and trends, when the show takes place between 10 -12 September at the Donald E Stephens Convention Center in Rosemont, Illinois.
A new area introduced this year, FlexPack@Labelepo, will focus on flexible packaging and shrink sleeves, allowing attendees to see the latest equipment and materials from leading industry suppliers in the flex pack sector. Additionally, this area will highlight technology and solutions for label converters interested in diversifying into flexible packaging production as well as traditional wide-web flexible packaging converters wishing to amplify their operation.
A flexible packaging master class will also take place on 10 September to provide expert guidance into how label converters can enter or expand into this lucrative market.
Also featured is an RFID (radio frequency identification) experience, where attendees will get the opportunity to learn more about the growth of RFID, see live demonstrations of how smart labels are produced as well as understand how data is stored, tracked and managed.
The RFID in labels and package printing workshop taking place on 12 September aims to provide the necessary technical knowledge for label and other converters looking to move into the arena of RFID and smart labelling.
Exhibitors will also get the chance to present new technologies and solutions in a 20-minute presentation at the Innovation Stage.
TLMI, the sponsoring partner for Labelexpo Americas 2024, will host an Eco Stage on the first two days of the show, presenting the latest developments in sustainability.
The Eco Stage is designed to support a better performing, more environmentally conscious label and package printing industry. Sessions include topics such as tackling the big myths surrounding sustainable packaging, what converters should really be concerned about and the key takeaway actions.
Tasha Ventimiglia, group director, Labelexpo Americas, said, ‘Flexible Packaging, sustainability, RFID, AI and automation are all key topics that are trending in the label and package printing industry right now, so it made sense to capitalise on these trends at this year’s Labelexpo Americas. FlexPack@Labelexpo, for instance, will allow attendees to see short run, added-value flexible packaging, including all the ancillary equipment, thermal lamination, pouching equipment, materials, and coatings required to enter this demanding market. We look forward to showcasing these fast-growing areas of the industry to all attendees.’
